Monday, February 4, 2013
Emerging Semiconductor Technologies - Device Transitions and Gaps
Emerging Semiconductor Technologies - Device Transitions and Gaps by R. Jammy PhD. It is a 3D world at the nanoscale, Future is functional diversity vs device density, Multiple materials/diverse devices on same Si die, Sense, compute, store, transmit: Integrated functionality, Hetero-integration at the chip and package levels, Scaling paradigms: System level power reduction, Equivalent performance gain, Band width. Current tools/metrology/defectivity are made for 2D-micro world, Need cost-effective, enabling tools for 3D-nano world, Need early design-integration-technology coordination.