Wednesday, January 9, 2013

Thin Wafers

Thin Wafers - Advanced Probe Card lowest contact forces ~ 2g per contact, Thin Die may require <1g, Probe before backside processes (BG, CMP, Etch), Use Non-contact probing? Film Frame? Backside Probe on Carrier? Backside processes induce defects that go untested. Many Questions with Alternatives or substrates

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