Thursday, January 24, 2013

Foundry Perspective on 2.5D/3D Chip Stacking

Foundry Perspective on 2.5D/3D Chip Stacking by Kurt Huang - This presentation includes Initial demand driven by BW, power, form factor and heterogeneous integration, Working models still evolving towards optimum, Open eco-system nurtures innovations for challenges, Cultivated eco-System mediated by SoC/system providers.

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