Monday, December 10, 2012

3D Process Integration & 3D Chip Stacking

3D Process Integration & 3D Chip Stacking - TOSHIBA Corporation Semiconductor & Storage Products Company Center For Semiconductor Research & Development - Motivation of 3D IC, 3D Process Integration, 3D Chip Stacking, After our BiCS proposal, various 3D NAND cells have been proposed. BiCS has smaller cell size, simpler process and better disturb immunity. BiCS is the most promising 3D Flash memory.

http://electronics.wesrch.com/paper-details/pdf-EL1SE1UN1BATD-3d-process-integration-3d-chip-stacking

No comments:

Post a Comment