Tuesday, October 23, 2012

3D IC Packaging Enablement Challenges Ahead - a panel of experts

Electronics Papers about 3D IC Packaging Enablement Challenges Ahead - a panel of experts, How to enable building the 3D ecosystem and Ceramic and Organic interposers with weSRCH.com.

http://electronics.wesrch.com/paper-details/pdf-EL1SE1SFLKSKQ-3d-ic-packaging-enablement-challenges-ahead-a-panel-of-experts

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